300mm wafer dicing

information on process improvements at american Precision dicing


This website was created to spread the word about our new and improved capabilities.

For some time we have been using an older and unsupported dicing saw to dice 300mm wafers.

It did a good job but recently it had a catastrophic failure which forced us to replace it. We opted to go for a high end machine instead of just finding an equivalent machine.

This site has some background and details some of our new capabilites related to dicing 300mm wafers.